Advanced Packaging

Under-Bump Metallisation (UBM)

For low-cost flip chip contact bumping without wiring or for sinterable contact metallisation, ISIT offers a chemical, i.e. template free, deposition of Nickel and Gold (Ni-Au). The electroless nickel / gold (ENIG) deposition process is available for wafers up to 200 mm diameter. Due to our long-year experience with a large variety of customer wafers, this process runs very stable.

The wafers will be provided first with the chemical Ni-Au UBM and are afterwards ready for further process steps like thinning, bumping or sawing. With our technological approach “UBM first” the risk for wafer breaking is strongly reduced.