The "Advanced Packaging" group is specialised in detecting and promoting new trends and technologies in electronics packaging. The industrial challenges of tomorrow are addressed in direct collaboration with suppliers of materials, components, modules and equipment. As an example, the automatic pick-and-place assembly of thin dies on flexible substrates was already developed several years ago. For the encapsulation of MEMS components, the glass frit bonding was developed and later on replaced by the more efficient metallic bonding. ISIT equally takes part in current developments in organic electronics and RFID technology.