Advanced Packaging

Module Integration

The Fraunhofer ISIT offers a variety of concepts for module integration. On one hand, the classical techniques of assembly and interconnect are available, e.g. to build prototypes or to set up a pilot production. ISIT also gives advice to customers regarding the planning of multi chip modules or system-in-package solutions. On demand, ISIT provides test chips and -substrates from the existing portfolio or as an individually adapted solution.
Furthermore, the ISIT actively promotes new process technologies, be it as an exclusive development partner or by acquisition of public funding on a national or European level, e.g. to foster SME research or international cooperation