Advanced Packaging

Power Modules

The awareness for efficient power electronic module integration is increasing dramatically. Smart control of energy-consuming applications and their intelligent system integration offer many benefits:
• miniaturisation
• cost reduction
• energy savings and
• increades reliability

Among the development of customised assemblies, ISIT equally offers prototype series production and qualification services for industrially manufactured components and power modules. For new assembly projects, a material- and process optimisation as well as a customer specific packaging are made. Bare PowerMOS component dies are available for these tasks that are produced in house by an industrial semiconductor manufacturer. Special experience lies in the assessment of quality and reliability, e.g. by a thermal analysis of assemblies and X-ray imaging of mounted dies. The services offered at ISIT comprise substrate design, assembly and interconnect technologies and full module qualification. For mounting semiconductor power components, die soldering under vacuum or inert gas atmosphere can be performed.
• Wafer dicing saws
• Die bonder, inline and batch die soldering
• Thin wire bonder (ball- and wedge bonder)
• Thick wire bonder
• Dispenser for encapsulation
• Electrical load testing up to 600 A
• Package sealing (laser welding)
• Quality and reliability assessment techniques