Advanced Packaging

Embedded Die

The Embedded Die technology allows it to abstain from cost intensive housings for microelectronic devices. Instead of mounting a CSP or flip chip component on the surface of a circuit board it will be placed “one level below”. The chip is an active part within the substrate enabling valuable space for SMD mounting of further components.
Based on our experience, we advise our customers on generating concepts or quality and reliability assessments and we offer selected joining technologies for realizing prototypes and pre-series.