Advanced Packaging

Multi-Chip Modules

Multi-Chip Module

Modular integration of bare dies in multichip modules offers advantages in terms of higher integration density, system speed and signal integrity. Such integration can also lead to significant savings in costs and development times. ISIT provides all required assembly technologies. Adhesive and soldering techniques are used to mount the unpackaged ICs and microsystem component dies. Bonding is carried out by means of wire bonding or flip-chip assembly. Depending on the specific application, circuits are protected under a polymer sealing mass or in a hermetically sealed package. Multichip modules are classified according to the basic technology used in the production of the circuit substrate:
• MCM-L: printed circuit board
• MCM-C: thick-film ceramics
• MCM-D: thin-film on Si or ceramics