Microsystems Technology

Deposition Processes

Metallabscheidung

For realization of many different devices in metall-surface-micromachining technology ISIT has a lot of different metal depositon proceses available. Beside sputter- and evaporation processes for metalls like Aluminum, Copper,Titanium, Gold also an automated electroplating tool for deposition of Gold, Copper, Tin and Nickel is available.