Quality and Reliability

Electronic Components and Assemblies

Bondverbindung

Gefügedarstellung einer Cu-Dickdraht Bondverbindung

Gehäuse

Aufgeätztes Gehäuse

Tombstoning

Tombstoning von C0201

Material- and Damage Analysis

Evaluation of production materials (solder, solder paste, flux, adhesives), electronic components, printed circuit boards and assembled modules by
● wetting force measurement,
● determination of layer thickness,
● cross-section preparation,
● scanning electron microscopy and EDX analysis,
● microfocus X-Ray imaging,
● acoustic scanning microscopy,
● infrared spectroscopy (FTIR analysis),
● etching of solder joints and copper metallisation,
● Decapsulation of molded packages,
● Detection of lead

Contamination, Corrosion and Residual Substance Analysis

● identification and localisation of residual substances,
● surface resistance measurements,
● evaluation of coatings (thickness homogeneity, curing).

Assessment of Manufacturing Quality according to Industry Standards

Solder joint assessment according to IPC-A610:
● solder meniscus formation,
● solder fill in Through-Hole Technology,
● de-wetting,
● detection of solder joint properties like contact angle, metallurgical structure, grain boundary layers (phase formation), short circuits due to solder bridges and -beads, open contacts, missing solder, infringement of isolation clearance, incomplete liquefaction,
● component positioning (lateral displacement, rotation error, polarity, overhang),
● tombstoning
● component damage by thermal overload (popcorning, pad lifting)


Electrical Measurement

● verification of specification datasheet
● high frequency parameter analysis up to 40 GHz
● multichannel measurement in climate chamber

Reliability Assessment

Degradation by thermal and/or mechanical loads:
● cracks in solder material by aging,
● substrate damage,
● dissolution effects on printed circuit boards and components,
● documentation of solder alloy microstructures and interfaces,
● identification of inter-metallic phases