Quality and Reliability

Power Electronics, Components and Modules


Zuverlässigkeit von Dickdrahtbondverbindungen

Assessment of Quality and Reliability

● Electrical Measurements (e.g. verification of characteristic datasheet specifications),
● thermal measurements (e.g. by infrared thermography):
     ● static thermal resistance (mW...kW),
     ● heating behavior,
     ● transient heat distribution (thermal impedance),
     ● power cycle tests up to 2000 A,
     ● temperature cycles.

Material related evaluation of electronic assemblies

● analysis of thermo-mechanical behavior,
● description of damage mechanisms, failure analysis and damage level evaluation in solder joints and bond contacts by metallurgical methods.

Evaluation of Reliability and Lifetime Prediction

● product lifetime prediction based on observed damage mechanisms,
● transfer of mission profile under actual operating conditions (active and passive temperature changes) to test cycles.

Thermal Engineering

● simulation of the heat balance (components, modules and assemblies),
● modelling of static thermal resistance,
● modelling of transient heat distribution (heating behavior),
● modelling of mechanical loads due to material incompatibility
(thermo-mechanical mismatch, warpage of layer composites, solder creeping),
● heat sink calculation, e.g. dimensioning of air- and liquid coolers,
● evaluation of cooling concept efficiency.

Development of Assembly Concepts

● optimisation of thermal resistance,
● evaluation of relevant characteristics in production quality and reliability,
● prototype manufacturing,
● power balling.