Facilities and Equipment
Fraunhofer ISIT has access to a 200 mm Silicon technology line (2500 m²) for front-end processes (MOS and PowerMOS). Specific processes for MEMS and NEMS as well as for packaging are implemented in a special newly built cleanroom (1000 m²). This includes wet etching, dry etching, DRIE, deposition of non-IC-compatible materials, lithography with thick-resist layers, gray-scale lithography, electroplating, microshaping, and wafer bonding. Further cleanroom laboratories are set up for chemical-mechanical polishing (CMP) and post-CMP processing.
Extra laboratories covering an area of 1500 m² are dedicated to electrical and mechanical characterization of devices, assembly and interconnection technology, and reliability testing. Fraunhofer ISIT also operates a pilot production line for Li-polymer batteries. The institute’s facilities have been certified to ISO 9001:2008 for many years.