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Fraunhofer Institute for Silicon Technology
Fraunhofer Institute for Silicon Technology
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AC2DC-Converting AC connections to DC connections with higher power transmission
Active front end converter based on MMC
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TROM2 chip: A chip for mask production
MEMS Applications
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MEMS Applications
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Acoustic systems and microdrives
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Sputtern & Evaporieren
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Electroless Ni / Pd / Au Plating (ENEPIG)
Reactive Ion Etch (RIE)
Chemical-mechanical polishing (CMP)
Assembly production, quality and reliability
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Hands-On Lithium-Ion Battery Seminar
Fraunhofer Annual Conference 2021
FED Conference: PCB Design for Production
Citizens' festival: 75 years of the state of Schleswig-Holstein
Technlogy Seminar - Design for Manufacturing
Lumen + Colours
Technology Days Printed Circuit Board & Assembly
Online-Messe
Microtec nord 2022
Science Day Kiel 2022
Seminar | Smart Power - Battery technologies and the way to sustainable electrification
Microtec nord 2023
Girls' Day 2024
Science Match 2021
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2022
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Information on the COVID-19 pandemic for customers, cooperation partners and service providers of Fraunhofer ISIT
Advent Calendar
MEMSification Campaign
Energy Harvester
RGB Laser Light Source
LIDAR systems
NeurOSmart
6-axis IMU device (inertial measurement unit, IMU)
Infrared sensors
Miniaturized ozone generator
Ultrasonic sensors
In-Ear-Speaker
Microcoils
TROM2-Chip
FAB-SH
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FAB-SH
Rapid Prototyping
Dry Coating
High-power batteries with extended lifetime
Overview
Equipment
Cell-internal sensor technology
Power400
Battery Systems for Special Applications
Overview
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Power400
Smart Battery Cells
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Events
CMP-Usermeetings
WET 15
WET 15
Presentations of the 15th WET Users Group Meeting 2022
The Value of Wastewater 11.2022 Jochen Ruth Pall Microelectronics [ PDF 3.4 MB ]
SicOzone Clean 11.2022 Bernhard Hammerl Siconnex; Hof bei Salzburg, Austria [ PDF 3.65 MB ]
Challenges with SEMI S2 Fire Protection Compliance 11.2022 Matt Wyman Kfpi; Dalles, USA [ PDF 3.93 MB ]
Latest ionization products from Simco ION 11.2022_Jurgen Nouwens CCT Europe BV; Helmond, Netherlands [ PDF 2.75 MB ]
Fraunhofer Institute for Silicon Technology