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Fraunhofer Institute for Silicon Technology
Fraunhofer Institute for Silicon Technology
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Brief Portrait
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Brief Portrait
Profile
Cooperation with Fraunhofer ISIT
Research Fab Microelectronics Germany
Dr. rer. nat. habil. Axel Müller-Groeling
ISIT Quality-Managementsystems
Power Electronic
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Power Electronic
Advanced Power Transistors
IGBTs
PowerMOS
Power Diodes
Electrical Characterization
Process Technology
Power Electronic for Renewable Energy Systems
Power Electronic Systems
Battery Systems for Special Applications
Overview
Equipment
Services
Micro Fabrication Technologies
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Micro Fabrication Technologies
Wafer-Level Packaging and Processes
Wafer-Level Packaging
Cap Wafers
Glass-Frit Bonding
Eutectic Bonding
Anodic Bonding
Neon Ultra-Fine Leak Test
Glass Micromachining
Individual Processes
Process Integration and Pilot Production
Poly Silicon Process Platform
Inertial Sensors
Post-CMOS Integration
Pilot Production / Prototyping
Module Services
Module Integration
Back-End Technologies
Stress Controlled Assemblies
Ultra-thin Dies
Embedded Die
MEMS Modules
Power Modules
Chip-Size Packaging
Bumping and Balling
Under-Bump Metallisation
Electrical Through-Connections
Sealing Frames
Test Wafers and Substrates
Silicon Wafers
Glass Wafers
Test Substrates
Quality and Reliability
Electronic Components and Assemblies
Power Electronics, Assemblies, and Modules
Application Center for Process Technology in Assembly Manufacturing
MEMS-Applications
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MEMS-Applications
Optical Systems
3D Camera
Laser-Material-Processing
Acoustic Systems and Micro Actuators
Ultrasound Transducers
In-Ear-Speaker
MEMS Energy Harvesting
Technology
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Technology
Power Electronic
Semiconductor Technology for Powerdevices
GaN-Transistor
Laserannealing
Bonder and Debonder
SEM and FIB
Thermography
Powersystems Simulation Design Analysis
Finite Element Method (FEM) Simulation
Hardware Development
Double Pulse Test Bench
Power Converter Test Bench
Thermal Imaging
Rapid Prototyping Control
Battery Technology
Lithium Battery Technology
Micro-manufacturing processes
Processes on Wafer-Level
Lithography
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Chemical Vapor Deposition (CVD)
Sputtern & Evaporieren
Electroplating
Electroless Ni / Pd / Au Plating (ENEPIG)
Reactive Ion Etch (RIE)
Chemical-mechanical polishing (CMP)
Assembly production, quality and reliability
MEMS-Applications
Poly Silicon MEMS Technology Platform
Piezo MEMS Technology Platform
Powder MEMS Technology Platform
News
Events
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Events
Aspekte moderner Siliziumtechnologie
CMP-Usermeetings
CMP 41
Wet 12
ISIT-Lötseminare für die Baugruppenfertigung
Jobs
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Jobs
Bachelor- / Masterarbeiten
Praktika / Ausbildung
Werkstudenten/innen
Publications
Trade Fairs
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Trade Fairs
Photonics West SPIE 2020
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English
Technology
Power Electronic
Powersystems Simulation Design Analysis
Powersystems Simulation Design Analysis
Teasers Set
Finite element method (FEM) simulation
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Hardware Development
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Double Pulse Test Bench
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Power Converter Test Bench
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Thermal Imaging
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Rapid Prototyping Control & Hardware-in-the-loop
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Fraunhofer Institute for Silicon Technology