ISIT participations in trade fairs

Fraunhofer ISIT presents regularly the latest research results and expertise at national and international trade fairs. Technological issues and trend-setting topics are discussed by intensive exchange of information with our customers.

Photonics West SPIE 2020, San Francisco, California, USA

1 – 6 February 2020

 

ISIT-Topic:

Micro actuators for optical application:

  • ■ Hermetically sealed 2D Micromirror Scanner for Laser Projection Display
    ■ LIDAR Distance Measurements
    ■ Laser Material Processing

 

More information.

Mädchen für Mint 2020, Itzehoe

25. February 2020

 

Battery Japan 2020, Tokio

25. - 27. February 2020

 

 

ISIT-Topic:

■ Accumulators as intermediate storage for electrical energy

Energy Storage Europe 2020, Düsseldorf

10. – 12. March 2020

 

 

ISIT-Topic:

■ Accumulators as intermediate storage for electrical energy

ees Europe 2020, München - cancelled

17. - 19. June 2020

 

ISIT-Topic:

  • ■ Accumulators as temporary storage for electrical energy

Hannover Messe 2020 Integrated Energy, Hannover - cancelled

13. – 17 July 2020  

ISIT-Topic:

  • ■ Accumulators as temporary storage for electrical energy

PCIM 2020, Nürnberg - cancelled

28. - 30. July 2020

 

ISIT-Topic:

  • ■ Development of Power Electronic Components GaN-Based
    ■ Quality and Reliability Tests in Power Electronics, Damage Analysis
    ■ Development of Highly Reliable Components and Systems
  • ■ Innovation Cluster Power Electronics and Application Centre Hamburg

 

 

SMT 2020, Nürnberg - cancelled

28. - 30. July 2020

 

ISIT-Topic:

  • ■ Process evaluation and optimization in the manufacturing of electronic assemblies:
    ■ Prototypes, functional models, pre series, technology and process transfer, training
    ■ Quality and reliability of electronic assembilies: assessment of production quality, damage analysis
    ■ Wafer level Packaging: Vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers

Nordjob Unterelbe Westküste 2020, Brockdorf -cancelled

01. - 02. September 2020

 

 

Battery Show Europe, Stuttgart - cancelled

15. – 17. October 2020

 

ISIT-Topic:

■ Accumulators as intermediate storage for electrical energy

Electronica 2020, München - No participation due to Corona

10. – 13. November 2020

 

ISIT-Topic:

Micro actuators for optical application:

■ Hermetically Sealed 2D Micro-Mirror Scanners for Laser Projection Displays
■ LIDAR Distance Measurement and Laser Material Processing
■ Glass Flowing, Glass Panels

Wind Energy Hamburg 2020, Hamburg

01.- 04. December 2020

 

ISIT-Topic:

  • ■ Development of Components for Power Electronics
    ■ Network Power Electronics Schleswig-Holstein
    ■ Energy Storage Systems with DC/DC Converter for Storing Regenerative Energy
    ■ NEW 4.0 System Modelling and System Services for Energy System Transformation
  •  

Past Trade Fairs

Nortec 2020, Hamburg

21. – 24. January 2020

 

 

ISIT-Topic:

Quality and reliability of electronic assemblies:

  • ■ Evaluation of Manufacturing Quality, Damage Analysis


Process evaluation and optimization in the production of electronic assemblies:

  • ■ For Prototypes
    ■ Functional model
    ■ Pre-series
    ■ Accompanying Technology and Process Transfer
    ■ Rework and Training

Husum Wind, 2019

 

10. – 13. September 2019

 

ISIT-Topics:

  • Development of power electronics
  • Network Power Electronics Schleswig-Holstein
  • Energy storage systems with DC / DC converter for renewable energy
  • NEW 4.0 System modeling and system services for the energy transition

Mikrosystemtechnik Kongress 2019, Berlin

28. – 30. 10. 2019

 

ISIT-Topics:

  • MEMS speaker with piezoelectric drive for mobile communication
  • Hermetically sealed 2D Micromirror Scanner for Laser Projection Display, LIDAR Distance Measurements and Laser Material Processing
  • MEMS Technology Platforms: Powder, Piezo, Poly-Silicon, Glass Flow

Productronica 2019, München

12. – 15. November 2019

 

ISIT-Topics:

  • MOEMS Production (production and measurement of scanner mirrors)
  • Wafer Level Packaging WLP (Vacuum Packaging with Defined Internal Pressure Including Soldering for WLP Chipsize Packages)