ISIT participations in trade fairs

Fraunhofer ISIT presents regularly the latest research results and expertise at national and international trade fairs. Technological issues and trend-setting topics are discussed by intensive exchange of information with our customers.

MikroSystemTechnik Kongress 2021, Ludwigsburg

08. - 10.11.2021

ISIT-Topic:

  • Fraunhofer ISIT has developed a compact, powerful and versatile magneto-mechanical MEMS energy harvester and presents it at the MST-Kongress. The patented PowderMEMS technology enables the integration of micromagnets on wafer level, allowing non-contact energy harvesting both in resonance and by low frequency excitations.

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COMPAMED 2021, Düsseldorf

15. - 18.11.2021

ISIT-Topic:

  • Accumulators for medical applications

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Nortec 2022, Hamburg

25. - 28.01.2022

ISIT Topics:

  • Quality and reliability of electronic assemblies: Manufacturing quality evaluation, failure analysis
  • Process evaluation and optimization in the manufacturing of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, rework and training

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DAGA 2022, Stuttgart

21. - 24.03.2022

ISIT Topics:

  • MEMS Speakers and Ultrasonic Transducers

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Laser 2022, Munich

26. - 29.04.2022

ISIT Topics:

  • Micro actuators for optical applications; Hermetically sealed 2D micromirror scanners for laser projection displays, LIDAR distance measurement and laser material processing, glass flutes, glass panels

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SMT 2022, Nuremberg

10. - 12.05.2022

ISIT Topics:

  • Process evaluation and optimization in the production of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, training
  • Quality and reliability of electronic assemblies: Evaluation of manufacturing quality, failure analysis
  • Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging

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PCIM 2022, Nuremberg

10. - 12.05.2022

ISIT Topics:

  • Development of GaN-based power electronics components
  • Quality and reliability investigations in power electronics, failure analysis
  • Development of highly reliable devices and systems Innovation Cluster Power Electronics and Application Center Hamburg

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IEEE IUS 2022, Venice, Italy

10. - 13.10.2022

ISIT Topics:

  • Ultrasonic transducer
  • Speaker as well as sensors based on the modulation of surface acoustic waves (SAW).

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COMPAMED 2022, Düsseldorf

14. - 17.11.2022

ISIT Topics:

  • Accumulators for medical applications

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Electronica 2022, Munich

15. - 18.11.2022

ISIT Topics:

    Power Electronics

  • Development of GaN-based power electronics components

    Battery systems for special applications

  • Innovative energy storage technologies

    Optical Systems

  • Scanners for laser projection displays, LIDAR distance measurement and laser materials processing
    Glass flutes, glass panels

    Acoustic systems and micro actuators

  • Ultrasonic transducers, speakers and SAWs

    Microfabrication processes

  • Processes for glass flow, Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging
  • Process evaluation and optimization in the production of electronic assemblies
  • Prototypes, functional models, pre-series, accompanying technology and process transfer, training courses

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AES Convention 2022

Date follows

ISIT Topics:

  • Ultrasonic transducer
  • Speaker as well as sensors based on the modulation of surface acoustic waves (SAW).

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Mädchen für Mint 2022, ISIT-Itzehoe

Date follows

  • Join MINT - Action day for schoolgirls in Steinburg at Fraunhofer ISIT

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Vocatium 2022, Trade fair for education + studies

Date follows

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Past Trade Fairs

Photonics West, San Francisco

06. - 11.03.2021

ISIT Talks:

  • A 2D circular-scanning piezoelectric MEMS mirror for laser material processing
  • Innovative ECDL design based on a resonant MEMS scanner for ultra-fast tuning in the MIR range
  • A designing and manufacturing platform for AlScN based highly linear quasi-static MEMS mirrors with large optical apertures

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SMT 2021, Nürnberg - Due to Corona cancelled

04. - 06.05.2021

ISIT-Topics:

  • Process evaluation and optimization in the production of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, training.
  • Quality and reliability of electronic assemblies: Evaluation of manufacturing quality, failure analysis
  • Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging

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PCIM 2021, Nürnberg

31. 08 - 02.09.2021

ISIT-Topics:

  • Development of GaN-based power electronics components
  • Netzwerk Leistungselektronik Schleswig-Holstein
  • Powder MEMS technology for power electronics

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Productronica 2021, München

16. - 19.11.2021

ISIT-Topics:

  • MOEMS manufacturing (production and measurement of scanner mirrors)
  • wafer level packaging WLP (vacuum packaging with defined internal pressure including solder balling for WLP chip size packages).

 

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