Fraunhofer Institute for Silicon TechnologyFraunhofer ISIT presents regularly the latest research results and expertise at national and international trade fairs. Technological issues and trend-setting topics are discussed by intensive exchange of information with our customers.
ISIT participations in trade fairs
MikroSystemTechnik Kongress 2021, Ludwigsburg
08. - 10.11.2021
ISIT-Topic:
- Fraunhofer ISIT has developed a compact, powerful and versatile magneto-mechanical MEMS energy harvester and presents it at the MST-Kongress. The patented PowderMEMS technology enables the integration of micromagnets on wafer level, allowing non-contact energy harvesting both in resonance and by low frequency excitations.
COMPAMED 2021, Düsseldorf
Nortec 2022, Hamburg
25. - 28.01.2022
ISIT Topics:
- Quality and reliability of electronic assemblies: Manufacturing quality evaluation, failure analysis
- Process evaluation and optimization in the manufacturing of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, rework and training
DAGA 2022, Stuttgart
Laser 2022, Munich
26. - 29.04.2022
ISIT Topics:
- Micro actuators for optical applications; Hermetically sealed 2D micromirror scanners for laser projection displays, LIDAR distance measurement and laser material processing, glass flutes, glass panels
SMT 2022, Nuremberg
10. - 12.05.2022
ISIT Topics:
- Process evaluation and optimization in the production of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, training
- Quality and reliability of electronic assemblies: Evaluation of manufacturing quality, failure analysis
- Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging
PCIM 2022, Nuremberg
10. - 12.05.2022
ISIT Topics:
- Development of GaN-based power electronics components
- Quality and reliability investigations in power electronics, failure analysis
- Development of highly reliable devices and systems Innovation Cluster Power Electronics and Application Center Hamburg
IEEE IUS 2022, Venice, Italy
10. - 13.10.2022
ISIT Topics:
- Ultrasonic transducer
- Speaker as well as sensors based on the modulation of surface acoustic waves (SAW).
COMPAMED 2022, Düsseldorf
Electronica 2022, Munich
15. - 18.11.2022
ISIT Topics:
Power Electronics
- Development of GaN-based power electronics components
Battery systems for special applications
- Innovative energy storage technologies
Optical Systems
- Scanners for laser projection displays, LIDAR distance measurement and laser materials processing
Glass flutes, glass panels
Acoustic systems and micro actuators
- Ultrasonic transducers, speakers and SAWs
Microfabrication processes
- Processes for glass flow, Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging
- Process evaluation and optimization in the production of electronic assemblies
- Prototypes, functional models, pre-series, accompanying technology and process transfer, training courses
AES Convention 2022
Date follows
ISIT Topics:
- Ultrasonic transducer
- Speaker as well as sensors based on the modulation of surface acoustic waves (SAW).
Mädchen für Mint 2022, ISIT-Itzehoe
Vocatium 2022, Trade fair for education + studies
Date follows
Past Trade Fairs
Photonics West, San Francisco
06. - 11.03.2021
ISIT Talks:
- A 2D circular-scanning piezoelectric MEMS mirror for laser material processing
- Innovative ECDL design based on a resonant MEMS scanner for ultra-fast tuning in the MIR range
- A designing and manufacturing platform for AlScN based highly linear quasi-static MEMS mirrors with large optical apertures
SMT 2021, Nürnberg - Due to Corona cancelled
04. - 06.05.2021
ISIT-Topics:
- Process evaluation and optimization in the production of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, training.
- Quality and reliability of electronic assemblies: Evaluation of manufacturing quality, failure analysis
- Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for 200 mm MEMS wafers, WL-CSP packaging
PCIM 2021, Nürnberg
31. 08 - 02.09.2021
ISIT-Topics:
- Development of GaN-based power electronics components
- Netzwerk Leistungselektronik Schleswig-Holstein
- Powder MEMS technology for power electronics
Productronica 2021, München
16. - 19.11.2021
ISIT-Topics:
- MOEMS manufacturing (production and measurement of scanner mirrors)
- wafer level packaging WLP (vacuum packaging with defined internal pressure including solder balling for WLP chip size packages).