Fraunhofer ISIT goes to the Photonics West SPIE 2020 in San Francisco! This year is all about microactuators for optical applications: high power laser-scanners, LiDAR systems and glas-packages.
Laser Material Processing
High Power Laser Scanner(with stroboscope illumination)
Laser material processing, laser welding, laser cutting etc.
The new MEMS scanners developed by Fraunhofer ISIT allow fast deflection of laser radiation with up to 4.5 kWatt at scan frequencies in the kilohertz range. For many manufacturing processes, this allows a considerable increase in throughput and, in many cases, new functionality and quality improvements. Dielectrically coated highly reflective mirrors with apertures of up to 20 mm are unique worldwide.
MEMS LIDAR Systems
LIDAR Systems / 3D Camera
The 3D camera is based on a 2D MEMS scanner which uses the principle of the phase difference of an emitted laser beam to the detected "echo" as distance measurement.
The phase detection algorithm enables 60 million 3D measurements per second. The camera has a resolution of 450 x 450 pixels and delivers six images per second. The depth resolution should be a few millimetres and the maximum detectable distance to the object is 2 m.
Glass packages for wafer-level packaging
Development of remelted glass wafers to achieve specially adapted optical functions.
Based on a forming technology of glass wafers developed and patented by Fraunhofer ISIT, micro lenses, reflectors and specially shaped optical windows can be mass-produced on wafer level, which allows a cost-effective mass production of micro-optical components. In combination with MEMS scanners and IR-MEMS devices, this manufacturing process is the key to hermetically sealed MEMS devices with optimal optical functionality.
Visit us at the Moscone Center, booth 4083.