Fraunhofer Institute for Silicon Technology
Fraunhofer Institute for Silicon Technology

IMAPS Fall Conference 2026

This year, the IMAPS Germany Fall Conference once again offers an important platform for professional exchange among researchers, manufacturers, industry representatives, and universities. The goal is to strengthen knowledge transfer and advance the further development of Germany as a business hub.

This year’s conference will focus on the following topics: design, modeling, and simulation; materials and processes; system integration technologies; and quality and reliability. These topics offer numerous opportunities to discuss current developments, gain new insights, and jointly advance innovative solutions.

Our researchers are attending this year's conference and look forward to engaging in professional dialogue with representatives from research, manufacturing, industry, and academia, as well as to actively shaping future developments.

Presentations by our researcher

As part of this year’s IMAPS Germany Fall Conference, ISIT researcher Alexander Barnbrock will present two technical talks.

The first presentation will focus on the topic “Aluminum Melt Filling for the Production of Through-Glass Vias (Al-TGV).”

If you have any questions regarding the content of this presentation, please feel free to contact Wolfgang Reinert (wolfgang.reinert@isit.fraunhofer.de) or Nils Burmeister (nils.burmeister@isit.fraunhofer.de).

The second presentation by Alexander Barnbrock will cover the topic “Micromounting Technology in the Sub-µm Range Using Live Alignment of Optical Components.” The contact person for this presentation and any further technical questions is Alexander Barnbrock (alexander.barnbrock@isit.fraunhofer.de).

We look forward to the exchange of ideas and to interesting discussions at the event.

Information about the presentations:

When: 11:15 a.m.–1:20 p.m. – During the Enabling Technologies Session

Where: Lecture Hall

Contact Persons

Alexander Barnbrock

Modul-Services

On-site contact person and contact for questions regarding the content of the presentation “Micromounting Technology in the Sub-µm Range Using Live Alignment of Optical Components”

E-Mail: alexander.barnbrock@isit.fraunhofer.de

Wolfgang Reinert

Micro-manufacturing processes

Contact person for questions regarding the content of the presentation 'Aluminum Melt Filling for the Production of Through Glass Vias (Al-TGV)'

E-Mail:

wolfgang.reinert@isit.fraunhofer.de

Nils Burmeister

Process integration and pilot production

Contact person for questions regarding the content of the presentation 'Aluminum Melt Filling for the Production of Through-Glass Vias (Al-TGV)'.

E-Mail: nils.burmeister@isit.fraunhofer.de

IMAPS Fall Conferenz 2026

The platform for professional exchange between research, manufacturing, industry, and universities in the field of assembly and joining technology.

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