TechBlog of Fraunhofer ISIT

In addition to the evaluation of complete assemblies, the business unit Microfabrication Processes of Fraunhofer ISIT also offers the evaluation of printed circuit boards and components used in electronics production. The focus here is on the wetting properties of the PCB pads and component connections, which serve as the basis for solderability.

The joint project "Smart Window" offers an exciting future perspective for modern ship navigation. Together with partners from industry and research, ISIT scientists have developed an intelligent solution for implementing an augmented reality display on a ship's bridge.

In order to extend the know-how on the topic of thick wire bonding of power semiconductor devices on FR4 substrates at ISIT, a feasibility study for a thick wire bonding process with 500µm Al thick wire was carried out as part of a microtechnologist's final thesis. Shear tests and cross-section analyses were used to evaluate the bonded joints for shear strength and crack formation.

As mobile robotic systems become more autonomous, the number of sensors increases, the effort required to link their data increases, and with it the need for computing power to realize reliable and safe real-time operation. Architecture scalability, sufficient transmission bandwidth between sensor and data processing, and minimization of power requirements are the main challenges for the development of high-performance computers to be used in mobile systems. It is predicted that in less than 10 years, the required computing capacity in the sensor periphery will have to match that of a supercomputer today. This requirement can only be met by a combination of hardware and software components specifically developed for each other.

Fraunhofer researchers have set themselves the task of supplying networked sensors with sufficient energy and storing the energy locally. The result is a variety of novel components.