Power electronics, microsystems and micro manufacturing are the core research and development activities of Fraunhofer ISIT.
In power electronics, we provide our customers a broad technology and system support, eg.
advanced device and process development of application specific power semiconductors (IGBTs, diodes, MOSFETs), new packaging technologies for state-of-the-art package concepts, and the design of high efficiency power converters with integrated condition monitoring for long lifetimes.
In the development of silicon-based microsystems, Fraunhofer ISIT can draw on a wealth of experience of more than 30 years. In doing so, the scientists take into account all aspects of the development of microelectro-mechanical systems (MEMS) starting with design and simulation to technology and component development and prototype production.
The micro manufacturing processes include all processes and services that are indispensable prerequisites for the research and development of MEMS components on the one hand, and are also direct service offers of Fraunhofer ISIT to the market.
Important offerings at ISIT include waferlevel packaging (WLP) and various single processes on waferlevel.