Fraunhofer Institute for Silicon Technology
Aging (thermal cycling, shock test, climate chambers, inert gas oven)
- Contamination measurement (Ionograph, IR-spectroscopy)
- Electrochemical measurement technology (galvanometer, potentiometer, impedance)
- Environmental test lab (climate chambers)
- High-current load cycling
- Inspection via AOI (automatic optical inspection)
- Inspection, visual (microscope, Ersascope®)
- Ionograph
- Layer thickness measurement
- Macro photography
- Mechanical testing (pull-, shear-, peel- and pressure testing system)
- Metallography: preparation and analysis
- Microfocus X-ray inspection
- Moisture Sensitivity Level (MSL) testing
- Optical microscope
- Package decapsulator
- Pressure Cooker Test (PCT)
- Printed circuit board testing according to IPC 6010
- Pull & shear test
- Reliability assessment
- Scanning Acoustic Microscope (SAM)
- Scanning electron microscopy (SEM) with EDX
- Shock test
- SMD rework (leadfree according to RoHS)
- SMD soldering process (leadfree according to RoHS)
- Solder Paste Inspection (SPI) via 3D inspection system
- Solderability testing
- Strain measurement
- Surface resistance (SIR test)
- Surface roughness
- Thermal resistance
- Thermographic measurement
- Thermomechanical strain measurement
- Through-Hole Technology (THT) process (leadfree according to RoHS)
- Wetting force measurement