Assembly production, quality and reliability

Aging (thermal cycling, shock test, climate chambers, inert gas oven)

  • Contamination measurement (Ionograph, IR-spectroscopy)
  • Electrochemical measurement technology (galvanometer, potentiometer, impedance)
  • Environmental test lab (climate chambers)
  • High-current load cycling
  • Inspection via AOI (automatic optical inspection)
  • Inspection, visual (microscope, Ersascope®)
  • Ionograph
  • Layer thickness measurement
  • Macro photography
  • Mechanical testing (pull-, shear-, peel- and pressure testing system)
  • Metallography: preparation and analysis
  • Microfocus X-ray inspection
  • Moisture Sensitivity Level (MSL) testing
  • Optical microscope
  • Package decapsulator
  • Pressure Cooker Test (PCT)
  • Printed circuit board testing according to IPC 6010
  • Pull & shear test
  • Reliability assessment
  • Scanning Acoustic Microscope (SAM)
  • Scanning electron microscopy (SEM) with EDX
  • Shock test
  • SMD rework (leadfree according to RoHS)
  • SMD soldering process (leadfree according to RoHS)
  • Solder Paste Inspection (SPI) via 3D inspection system
  • Solderability testing
  • Strain measurement
  • Surface resistance (SIR test)
  • Surface roughness
  • Thermal resistance
  • Thermographic measurement
  • Thermomechanical strain measurement
  • Through-Hole Technology (THT) process (leadfree according to RoHS)
  • Wetting force measurement