Processes on Wafer-Level

Processes and process modules for processing wafers in cleanroom and laboratory.

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Assembly production, quality and reliability

Methods and processes from bare die to assembly production and accelerated aging to damage analysis on field returns.

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Micro-manufacturing processes

The Fraunhofer ISIT has an industrial clean room with 1000 m² of clean room space for MEMS and MOEMS processes as well as another 200 m² clean room area for chemical mechanical polishing (CMP). In addition, 1500 m² of laboratory space for measurement technology, special processes and the further processing of the wafer into discrete components and assemblies is available. Additionally to complete process chains, ISIT also offers its customers individual processes. Customer-specific developments can either be industrialized at ISIT or transferred to the customer.

In the area of module manufacturing, individual processes are available, from chip assembly and module manufacturing via accelerated aging to the analysis of failure causes, although these methods also offer numerous application possibilities in semiconductor technology.

Processes on Wafer-Level

Assembly production, quality and reliability