MEMS Modules

MEMS components often require special assembly techniques, which cannot be realized by standard SMD processing. Besides aspects related to mechanical stress, the combination of MEMS components with other parts like ASICs is a common reason for dedicated housings. The resulting modules are usually referred as “System-in-Package”. Fraunhofer ISIT has a longstanding expertise in system integration of MEMS components, especially in combination with other electronic components like ASICS.

Thanks to a flexible infrastructure and quality assurance ISIT is able to offer the whole process chain from the development of a setup concept up to pilot production of new micro system modules. Following customer requests the packaging development can be accompanied by a FMEA and a control plan. The process can be transferred in a high-volume production environment after successful qualification, e.g. to AEC-Q100.

In the frame of the strategically oriented technology project DAVID (Sixth European Framework Programme), a number of key technologies was studied and advanced to integrate SiP in an even smaller volume. The primary motivation was the direct interconnect of IC and inertial MEMS structures, targeting the introduction of Chip Size Packaging (CSP) into the MEMS domain. These assembly concepts are particularly interesting for mobile electronic applications and for the automotive market.