Fraunhofer Institute for Silicon Technology
The following elements of "classical" back-end technology are available as ISIT service offers:
- Mechanical dicing
- Wafer thinning (grinding and polishing)
- Aluminum and gold wire bonding
- Die attach (manual and fully automatic)
- Module integration: Chip-on-Board (COB), multichip module (MCM)
- Dispensing of encapsulants (glob top, dam-and-fill)
In extension of the back-end technologies based on wire bonding, the flip chip and chip-size packaging (CSP) are of great importance, especially for mobile applications. The Fraunhofer ISIT disposes of equipment and technology for all basic assembly methods:
- Flip chip bonding based on soldering, epoxy dip and stud bumping (ultrasound-assisted)
- Conditioning of wafers for flip chip or chip size packaging by solder balling and solder paste printing
- Dispensing of underfill adhesives
The Fraunhofer Institute for Silicon Technology offers an exhaustive selection of test chips and substrates for process and machine evaluation.