Back-End Technologies

The following elements of "classical" back-end technology are available as ISIT service offers:

  • Mechanical dicing
  • Wafer thinning (grinding and polishing)
  • Aluminum and gold wire bonding
  • Die attach (manual and fully automatic)
  • Module integration: Chip-on-Board (COB), multichip module (MCM)
  • Dispensing of encapsulants (glob top, dam-and-fill)

In extension of the back-end technologies based on wire bonding, the flip chip and chip-size packaging (CSP) are of great importance, especially for mobile applications. The Fraunhofer ISIT disposes of equipment and technology for all basic assembly methods:

  • Flip chip bonding based on soldering, epoxy dip and stud bumping (ultrasound-assisted)
  • Conditioning of wafers for flip chip or chip size packaging by solder balling and solder paste printing
  • Dispensing of underfill adhesives

The Fraunhofer Institute for Silicon Technology offers an exhaustive selection of test chips and substrates  for process and machine evaluation.