Power Electronics, Assemblies, and Modules

Assessment of Quality and Reliability

  • Electrical Measurements (e.g. verification of characteristic datasheet specifications)
  • thermal measurements (e.g. by infrared thermography)
  • static thermal resistance (mW...kW)
  • heating behavior
  • transient heat distribution (thermal impedance)
  • power cycle tests up to 2000 A
  • temperature cycles

Material related evaluation of electronic assemblies

  • analysis of thermo-mechanical behavior
  • description of damage mechanisms, failure analysis and damage level evaluation in solder joints and bond contacts by metallurgical methods

Evaluation of Reliability and Lifetime Prediction

  • product lifetime prediction based on observed damage mechanisms
  • transfer of mission profile under actual operating conditions (active and passive temperature changes) to test cycles

Thermal Engineering

  • simulation of the heat balance (components, modules and assemblies)
  • modelling of static thermal resistance
  • modelling of transient heat distribution (heating behavior)
  • modelling of mechanical loads due to material incompatibility (thermo-mechanical mismatch, warpage of layer composites, solder creeping)
  • heat sink calculation, e.g. dimensioning of air- and liquid coolers
  • evaluation of cooling concept efficiency

Development of Assembly Concepts

  • optimisation of thermal resistance
  • evaluation of relevant characteristics in production quality and reliability
  • prototype manufacturing
  • power balling