Power Electronics, Assemblies, and Modules

Assessment of Quality and Reliability

• Electrical Measurements (e.g. verification of characteristic datasheet specifications)
• thermal measurements (e.g. by infrared thermography)
• static thermal resistance (mW...kW)
• heating behavior
• transient heat distribution (thermal impedance)
• power cycle tests up to 2000 A
• temperature cycles

Material related evaluation of electronic assemblies

• analysis of thermo-mechanical behavior
• description of damage mechanisms, failure analysis and damage level evaluation in solder joints and bond contacts by metallurgical methods

Evaluation of Reliability and Lifetime Prediction

• product lifetime prediction based on observed damage mechanisms
• transfer of mission profile under actual operating conditions (active and passive temperature changes) to test cycles

Thermal Engineering

• simulation of the heat balance (components, modules and assemblies)
• modelling of static thermal resistance
• modelling of transient heat distribution (heating behavior)
• modelling of mechanical loads due to material incompatibility (thermo-mechanical mismatch, warpage of layer composites, solder creeping)
• heat sink calculation, e.g. dimensioning of air- and liquid coolers
• evaluation of cooling concept efficiency

Development of Assembly Concepts

• optimisation of thermal resistance
• evaluation of relevant characteristics in production quality and reliability
• prototype manufacturing
• power balling