Wafer-Level Packaging and Processes

The ISIT process offer covers a portfolio of individual processes and technology platforms like wafer-level packaging and 3D glass micromachining.

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Process Integration and Pilot Production

Following the maxim „research and production in one location“, the Fraunhofer ISIT transfers components and processes from development into industrial production. A particular specialty in this field is the combination of MEMS processes with CMOS wafers.

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Module Services

From the connection on chip level through the production of assemblies and accelerated aging to latest fault analysis, ISIT offers support from the cradle to the grave of components.

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Micro Fabrication Technologies

This business unit focusses on processes, procedures and services which are essential for research and development in the field of MEMS applications as well as a direct service offer to the market. Wafer-level packaging (WLP) and various individual processes, which could even be realized on preprocessed CMOS wafers, are key aspects. In this respect, the development of appropriate technology solutions at the level of individual processes plays a significant role.

Based on these individual processes Fraunhofer ISIT established several qualified technology platforms. A typical example is a polysilicon process which can be used for micro mirrors as well as acceleration and angular rate sensors. Another one is our patented 3D glass micromachining based on a hot viscous glass flow process for the production of glass packages with spherical or inclined optical windows, mirrors, and lenses.

Following the maxim „research and production in one location“, Fraunhofer ISIT transfers developed components from the status of a prototype to a small-batch or pilot production. In cooperation with the X- FAB MEMS Foundry Itzehoe GmbH, which is also located on the company premises in Itzehoe, a seamless transition into industrial manufacture of large quantities succeeds.

In addition to wafer technologies Fraunhofer ISIT offers a series of module services such as special processes on chip level, production of assemblies in an industrial manufacturing environment, and the examination of quality and reliability of these assemblies under accelerated aging. Fraunhofer ISIT is looking back on more than 20 years of experience in this field. Thanks to state-of-the-art analytic methods like high resolution computer tomography the ISIT in well known for its fast and reliable fault analysis in case of production problems and field returns.

Wafer-Level Packaging and Processes

Process Integration and Pilot Production

Module Services