This business unit focusses on processes, procedures and services which are essential for research and development in the field of MEMS applications as well as a direct service offer to the market. Wafer-level packaging (WLP) and various individual processes, which could even be realized on preprocessed CMOS wafers, are key aspects. In this respect, the development of appropriate technology solutions at the level of individual processes plays a significant role.
Based on these individual processes Fraunhofer ISIT established several qualified technology platforms. A typical example is a polysilicon process which can be used for micro mirrors as well as acceleration and angular rate sensors. Another one is our patented 3D glass micromachining based on a hot viscous glass flow process for the production of glass packages with spherical or inclined optical windows, mirrors, and lenses.
Following the maxim „research and production in one location“, Fraunhofer ISIT transfers developed components from the status of a prototype to a small-batch or pilot production. In cooperation with the X- FAB MEMS Foundry Itzehoe GmbH, which is also located on the company premises in Itzehoe, a seamless transition into industrial manufacture of large quantities succeeds.
In addition to wafer technologies Fraunhofer ISIT offers a series of module services such as special processes on chip level, production of assemblies in an industrial manufacturing environment, and the examination of quality and reliability of these assemblies under accelerated aging. Fraunhofer ISIT is looking back on more than 20 years of experience in this field. Thanks to state-of-the-art analytic methods like high resolution computer tomography the ISIT in well known for its fast and reliable fault analysis in case of production problems and field returns.