The multiple degrees of freedom of the PowderMEMS process enables the creation of functional microstructures for a wide range of applications.
The multiple degrees of freedom of the PowderMEMS process enables the creation of functional microstructures for a wide range of applications.
By using appropriate powders, PowderMEMS can be used to produce porous microstructures with very high or very low thermal conductivity. By using e.g. metal powders, microcoolers with permeable structures can be created directly on wafer-level. Thus, efficient liquid cooling can be integrated on the Si wafer directly underneath a heat source. By using thermally poorly conducting powders, on the other hand, very good thermal insulation and simultaneous mechanical stabilization of thermal MEMS on e.g. thin film membranes can be achieved.
PowderMEMS enables the precise integration of micromagnets made of any magnetic material and in any shape on wafer level. This enables a high degree of miniaturization, optimal magnetic field geometries and a significant saving of raw materials.
PowderMEMS enables the precise integration of porous microstructures made of almost any material and in any shape at wafer level. This enables a high degree of miniaturization, and the integration of very large and, if required, reactive internal surfaces.