Fraunhofer ISITs wafer portfolio is complemented by corresponding FR4 substrates. Each substrate contains 24 chip positions divided in three groups. Chips can be placed either on the front or back side of the substrate depending on the desired pad configuration. The “FC 475 DDC” test board for example, features contacts for flip-chip connections on the front side and wire bonding on the back side.
Each chip position is surrounded by measurement pads, enabling easy continuity checks. In case of faults, the defective chip area can be located.