Application Center for Process Technology in Assembly Manufacturing


  • Process optimization in circuit board assembly: manufacturing processes like solder paste printing, component placement and soldering (reflow, wave, selective, vapor phase and special soldering techniques) are fine-tuned to match optimally
  • The introduction of novel technologies and methods is tested and transferred to customer specific equipment
  • Fine pitch solder paste printing for discrete components and for integrated circuits on wafer level
  • pin-in-paste manufacturing
  • glass soldering paste printing for sensor encapsulation at wafer level
  • introduction of new materials and tools, e.g. step-structured printing stencils and processes (e.g. jet dispensing)
  • soldering profile optimization in given process window for in-line, selective and rework soldering processes, in combination with thermal simulation and temperature measurement
  • multiple soldering processes using solder alloys with increasing melting points
  • manufacturing of functional samples, prototypes and pilot production series

SMD Rework Center

Conformity to valid industrial standards:

  • standardized handling of components and modules
  • rework of complex assemblies
  • selective soldering for completion of assemblies
  • gentle repair processes for electronic assemblies under consideration of valid industry standards
  • quality control via optical and X-ray inspection as well as cross section analysis
  • process training for operators on the customer's own equipment

Component and Material Qualification

  • soldering heat resistance
  • MSL-test according to J-STD 020
  • process- and manufacturing compliance
  • assessment of manufacturing parameters for RoHS conformity
  • solder paste evaluation according to recognized valid industry standards


● controllable assembly production
● practice-oriented process optimization in the electrical assembly production
● the optimized rework process
● manual soldering,
● lead-free soldering for power assemblies
● Technology Days
● In-house offers


Application Center for Electronic Assemblies


Available technologies