Application Center for Process Technology in Assembly Manufacturing

ISIT Line

• Process optimization in circuit board assembly: manufacturing processes like solder paste printing, component placement and soldering (reflow, wave, selective, vapor phase and special soldering techniques) are fine-tuned to match optimally
• The introduction of novel technologies and methods is tested and transferred to customer specific equipment
• Fine pitch solder paste printing for discrete components and for integrated circuits on wafer level
  
• pin-in-paste manufacturing
• glass soldering paste printing for sensor encapsulation at wafer level
• introduction of new materials and tools, e.g. step-structured printing stencils and processes (e.g. jet dispensing)
• soldering profile optimization in given process window for in-line, selective and rework soldering processes, in combination with thermal simulation and temperature measurement
• multiple soldering processes using solder alloys with increasing melting points
• manufacturing of functional samples, prototypes and pilot production series

SMD Rework Center

Conformity to valid industrial standards:

• standardized handling of components and modules
• rework of complex assemblies
• selective soldering for completion of assemblies
• gentle repair processes for electronic assemblies under consideration of valid industry standards
• quality control via optical and X-ray inspection as well as cross section analysis
• process training for operators on the customer's own equipment
  

Component and Material Qualification

• soldering heat resistance
• MSL-test according to J-STD 020
• process- and manufacturing compliance
• assessment of manufacturing parameters for RoHS conformity
• solder paste evaluation according to recognized valid industry standards
  

Training

● controllable assembly production
● practice-oriented process optimization in the electrical assembly production
● the optimized rework process
● manual soldering,
● lead-free soldering for power assemblies
● Technology Days
● In-house offers

Downloads:

Application Center for Electronic Assemblies

 

Available technologies