Support magnets for magnetic field sensors have so far been mounted inside or outside the package. PowderMEMS enables precise integration of the magnets at wafer level close to the sensor. This enables a high degree of miniaturization, optimal magnetic field geometries and a significant saving of raw materials.
Thermal flow sensors are conventionally manufactured on fragile thin film membranes. The failure of these membranes due to e.g. pressure surges is a common failure mode, which leads to total system failure. Our approach aims at stabilizing the membrane to avoid this failure mode.
MEMS gas and pressure sensors must be protected against harmful environmental influences such as particles or condensing moisture. Traditionally, the integration of protective caps is done as a single chip process. PowderMEMS offers the ability to produce a variety of porous protective caps in 200 mm / 8" substrates. The cap wafers can be directly bonded to the MEMS wafer – eliminating the need for single chip processes. By fabricating the protective caps in a MEMS process, further functionalization such as hydrophobation or catalytic surfaces can be achieved.
MEMS bio- and gas sensors require large reaction surfaces to achieve high sensitivity. Using PowderMEMS, porous microstructures with very large internal surfaces can be fabricated by exploiting the third dimension with the smallest footprint on 200 mm / 8" Si wafers. The inner surfaces can be modified e.g. with catalytic ALD layers or used for the immobilization of enzymes. By using established MEMS technologies, additional functional elements such as heaters and/or electrodes can be integrated.