Poly Silicon Process Platform

The PSM-X2 technology platform enables easy realization of inertial sensors and mirrors with moveable poly silicon actuators.

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Post-CMOS Integration

The combination of MEMS processes with preprocessed CMOS wafers offers plenty new possibilities.

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Pilot Production / Prototyping

Based on the maxim “Development and production at one place” Fraunhofer ISIT transfers processes and components from development to industrial production.

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Process Integration and Pilot Production

Based on the maxim "development and production at one place" Fraunhofer ISIT transfers established processes and technology platforms into a pilot or batch production. Later on the production may be industrialized and transferred into volume production even at the same location.

The PSM-X2 process platform for polysilicon surface micromechanics is a typical example. The process flow was developed over several years from the idea towards industrialization and AEC-Q100 qualification for one product. The process platform allows the manufacturing of multiaxial inertial sensors and micro mirrors. Based on the already existing process chain new designs can be realized with comparatively low development expenses and fast transfer into pilot production.

Another field of activity is the refinement of CMOS wafers by microsystem technology processes. The ISIT has a large portfolio of processes that cannot be found in a CMOS production. Galvanic structures, cavities and vias are just some typical examples for these processes. Also wafer-level packaging  applications are part of the typical scenarios. Another area of post-CMOS integration is further processing to a chip-size package .

Poly Silicon Process Platform

Post-CMOS Integration

Pilot Production / Prototyping