Companies are faced with the challenge of providing state-of-the-art front-end and back-end production capacities for 200 mm Si wafers in a flexible manner for series production and development projects – around the clock.
ISIT operates a state-of-the-art front-end semiconductor production line for 200 mm Si wafers in collaboration with Vishay Semiconductor Itzehoe GmbH. Vishay uses the line for the series production of power components (PowerMOS and IGBT). ISIT uses the same line for demanding development projects
Front-end production technology for 200 mm Si wafers Processing of ultra-thin substrates (< 50 µm) Dopant activation using laser activation Back-end processes: new metallization processes for advanced assembly techniques MEMS clean room with virtual tour
Series production of PowerMOS and IGBT power components in cooperation with Vishay Front-end development projects: process optimization, materials research, and technology development Back-end refinement for complex assembly techniques
Development and production at a single location, 24/7 Wide range of state-of-the-art semiconductor processes from a single source Access to ultra-thin substrates and innovative laser activation State-of-the-art metallization technologies for the most demanding requirements Virtual cleanroom tour for fast project planning