Process Technology

Companies are faced with the challenge of providing state-of-the-art front-end and back-end production capacities for 200 mm Si wafers in a flexible manner for series production and development projects – around the clock.

ISIT operates a state-of-the-art front-end semiconductor production line for 200 mm Si wafers in collaboration with Vishay Semiconductor Itzehoe GmbH.

  • Vishay uses the line for the series production of power components (PowerMOS and IGBT).
  • ISIT uses the same line for demanding development projects
 

Discover our MEMS clean room virtually!

Development and production at one location: 24/7

  • Front-end production technology for 200 mm Si wafers
  • Processing of ultra-thin substrates (< 50 µm)
  • Dopant activation using laser activation
  • Back-end processes: new metallization processes for advanced assembly techniques
  • MEMS clean room with virtual tour

  • Series production of PowerMOS and IGBT power components in cooperation with Vishay
  • Front-end development projects: process optimization, materials research, and technology development
  • Back-end refinement for complex assembly techniques

  • Development and production at a single location, 24/7
  • Wide range of state-of-the-art semiconductor processes from a single source
  • Access to ultra-thin substrates and innovative laser activation
  • State-of-the-art metallization technologies for the most demanding requirements
  • Virtual cleanroom tour for fast project planning