Electronic Components and Assemblies

Material- and Damage Analysis

Evaluation of production materials (solder, solder paste, flux, adhesives), electronic components, printed circuit boards and assembled modules by

  • wetting force measurement
  • mechanical testings
  • determination of layer thickness
  • cross-section preparation
  • scanning electron microscopy and EDX analysis
  • microfocus X-Ray imaging
  • computer tomography
  • acoustic scanning microscopy
  • infrared spectroscopy (FTIR analysis)
  • etching of solder joints and copper metallization
  • decapsulation of molded packages
  • detection of lead

Contamination, Corrosion and Residual Substance Analysis

  • identification and localization of residual substances
  • surface resistance measurements
  • evaluation of coatings (thickness homogeneity, curing)

Assessment of Manufacturing Quality according to Industry Standards

Solder joint assessment according to IPC-A610:

  • solder meniscus formation
  • solder fill in Through-Hole Technology
  • de-wetting
  • detection of solder joint properties like contact angle, metallurgical structure, grain boundary layers (phase formation), short circuits due to solder bridges and -beads, open contacts, missing solder, infringement of isolation clearance, incomplete liquefaction
  • component positioning (lateral displacement, rotation error, polarity, overhang)
  • tombstoning
  • component damage by thermal overload (popcorning, pad lifting)

Electrical Measurement

  • verification of specification datasheet
  • high frequency parameter analysis up to 40 GHz
  • measurement in climate chamber

Reliability Assessment

Degradation by thermal and/or mechanical loads:

  • cracks in solder material by aging
  • substrate damage
  • dissolution effects on printed circuit boards and components
  • documentation of solder alloy microstructures and interfaces
  • identification of inter-metallic phases