Best Poster Award

Electronics System-Integration Technology Conference

Impressions of the event



This year Fraunhofer ISIT was represented at the Electronics System-Integration Technology Conference in Sibiu (Hermannstadt), an important medieval European castle in Transylvania in Romania.

Organized by IEEE-EPS (formerly CPMT) since 2006, the Electronics System-Integration Technology Conference (ESTC) series is the premier meeting place for academics and industry to present and discuss the latest developments in packaging technology and new applications.

PRISMA poster


The winners of this year's Best Poster Award were also announced during the event.

Nils Burmeister, Vanessa Stenchly and Wolfgang Reinert are the winners of the Best Poster Award at ESTC 2022!  

"Development of a platform for functional glass packages for the integration of micro-optical and mechanical systems on wafer level" is the topic of the poster. Visitors of the ESTC could inform themselves about the glass packaging concept for scanner mirrors with electrical feedthroughs as well as about the concept of a miniaturized silicon-based RGB laser light source.

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