Lectures by our experts

In his presentation titled “The Influence of Electronics Design(ers) on the Quality and Reliability of Electronic Assemblies and Systems” Helge Schimanski will provide insight into his research in the field of module services.

The presentation will use examples to illustrate how development decisions affect the manufacturability and reliability of electronic assemblies. Through optimized layout design and material selection, the foundation for a reliable product can be laid as early as the development phase.

Topics covered include through-hole plating, press-fit connections, thermal stress on components and printed circuit boards, and how to minimize it through the use of suitable heat sinks, as well as issues related to panel separation. Design guidelines on these various aspects provide developers with assistance in creating layouts.

Information about the presentation:

23.09.2026 | 3:40 p.m. | Room K2

In his presentation titled “Resource-Optimized Electronics Production—Low-Temperature Soft Solder in Electronics Manufacturing” ISIT researcher Helge Schimanski will discuss and explain the rationale for using low-temperature soldering processes.

He will present the results regarding the environmental impact and the history of “low-temperature soldering.” Reliability studies will also be presented, such as those from the recently launched ZuniS research project on low-temperature soldering.

Low-temperature soldering processes help improve the environmental footprint and, thanks to innovative alloy compositions, can achieve reliability comparable to that of SAC solders when the mission profile is adapted to the solder’s melting temperature. In the ZuniS research project, ISIT is investigating the manufacturing parameters and reliability of low-temperature solders at elevated temperatures.

Information about the presentation: 

24.09.2026 | 2:40 p.m.

In her presentation “Are You Kidding? Yes, It Can Be Done!! An Experience Report from Metallography and Materials Testing” Katja Reiter will present her research on microstructural analysis in quality assurance and failure analysis.

The increasing miniaturization of electronic components poses new challenges for metallography and mechanical materials testing. Very small dimensions, delicate materials, and severely damaged components require careful adaptation of sample preparation, testing techniques, and microscopic evaluation. Using various application examples, the presentation will demonstrate how such tasks can be addressed using appropriate metallographic and mechanical methods. The focus will be on the examination of failure patterns using the example of a transistor with a GaAs chip, the evaluation of the mechanical load-bearing capacity of chip-size packages measuring 200 µm x 400 µm, and the characterization of corrosion-induced changes in aluminum wire bonds in a power module. The experiences described illustrate that even unusual testing tasks—which may initially seem difficult to accomplish—can be successfully resolved if the methods employed are consistently adapted to the specific sample and research question.

Metallography Conference Leoben

23.-25.09.2026 | Montanuniversity Leoben

Information about the presentation:

24.09.2026 | 09:40 | Kuppelwieser Lecture Hall (Montanuniversität Leoben)

Further information about the conference program:To Conference Program
Here you can find the full article: To the article

In his short presentation titled “Standardization Activities on Solid-State Transformers,” Dr. Marius Langwasser discusses the role of solid-state transformers (SST) in the electrification of large ships and current efforts to standardize this technology.

Solid-state transformers are a key technology for future DC-based vehicle electrical systems. They can help make onboard electrical power systems more efficient, modular, and compact, and enable the direct integration of batteries and fuel cells.

However, standardization remains a key challenge for the widespread and interoperable use of solid-state transformers. In his presentation, Dr. Marius Langwasser provides an overview of current standardization efforts and discusses their significance for the further development and market introduction of DC-based power systems in the shipping industry.

The presentation is part of the SMM workshop “Making DC Ships Market-Ready,” which focuses on current developments in DC-based energy systems for shipping. In addition to the ALL-DC-SHIPS project, the European project STEESMAT – Smarter Power for Cleaner Ships will also be presented. STEESMAT focuses on smart power systems for more efficient and lower-emission shipping.

As part of the workshop, Dr. Marius Langwasser will also take part in a panel discussion on DC ships.

SMM Workshop „Making DC ships market-ready“

September 3, 2026

SMM Hamburg | Hamburg Messe und Congress, Conference Room Copenhagen 1 (B Area) | 3:00 p.m.

You can find more information about the event and the program here!