Fraunhofer Institute for Silicon Technology
Fraunhofer Institute for Silicon Technology

Electroplating

During plating, thick metallic layers can be deposited by electrochemical deposition. At ISIT, galvanic gold, copper, nickel and tin processes are available for microstructuring. These offer a wide range of applications for metal-based microsystems.

Equipments and processes

  • automatic 8 "electroplating system SEMSYCO Triton (vinegar pretreatment and vacuum pre-treatment possible)
  • manual 6 "or 8" electroplating system RENA EPM-T 100 for process experiments
  • 2mm edge exclusion
  • Metals: gold, copper, nickel, tin up to 60μm layer thickness
  • Temperature range: room temperature up to 50 ° C

Application areas

  • Metal surfaces micromechanics
  • monolithic integration, CMOS / ASIC compatible processing
  • Electrostatics for electrostatics / distraction
  • Bonding frame for wafer level packing / (e.g. eutectic AuSi or AuSn bonding)
    • metal wiring
    • Bondpads, bumps
    • coils
    • 3D metal structures