During plating, thick metallic layers can be deposited by electrochemical deposition. At ISIT, galvanic gold, copper, nickel and tin processes are available for microstructuring. These offer a wide range of applications for metal-based microsystems.
During plating, thick metallic layers can be deposited by electrochemical deposition. At ISIT, galvanic gold, copper, nickel and tin processes are available for microstructuring. These offer a wide range of applications for metal-based microsystems.