Lithography has become a basic process in wafer processing. In the lithographic process, a photoresist is first uniformly applied to the substrate by spin coating or spraying. With the aid of a structured template, typically a chrome-coated glass mask, the open areas are exposed to UV light or particle irradiation, whereby the solubility of the resist changes. Depending on the resist and process control, a distinction is made between positive and negative resist. In the case of positive resist, exposed areas are released from the developer; in the case of negative resist, the unexposed areas are dissolved during development. After development, the further structuring of the substrate can be carried out by chemical or physical removal.