Fraunhofer Institute for Silicon Technology

Microelectronics and Microsystems Technology in Itzehoe, Northern Germany

Welcome to Fraunhofer ISIT, the specialist in development, manufacturing and integration of components in microelectronics and microsystems technology. On the following pages you can find information about Fraunhofer ISIT and different possibilities of cooperating with our institute.

Service Offer

FAB-SH Battery Systems

Customized battery solutions from northern Germany.

Power Electronics

Development and production of innovative active and passive power semiconductor devices based on silicon and gallium nitride.

Micro Manufacturing

Industrialization, quality and reliability of individual cleanroom processes, process platforms such as wafer-level packaging, and devices.

MEMS Applications

Microelectromechanical systems (MEMS): Design, development and manufacturing of MEMS components


Technology platforms

Learn about our clean rooms and technology platforms.



Press release / 26.6.2023

Highly reflective layers enable material processing with MEMS scanners

With their enormous power density, laser beams can weld and cut steel plates, polish workpieces or build up entire engine blocks layer by layer from metal powder in 3D printing. Highly reflective layers make it possible to use micromirror scanners in MEMS technology for precise path control.


Press release / 12.4.2023

Smart Window - Augmented Reality for ship management

With the joint project "Smart Window", Fraunhofer ISIT has worked together with partners from industry and the Fraunhofer Institute for Computer Graphics (IGD) on an intelligent solution for implementing an augmented reality display on a ship's bridge in order to process, filter and display all relevant data for ship operation in the future. Embedding the AR display in a window of the ship's bridge offers the possibility of displaying a variety of information directly in the skipper's field of vision, thus facilitating the skipper's work.


Techblog / 9.2.2023

Wetting and solderability testing at Fraunhofer ISIT

In addition to the evaluation of complete assemblies, the business unit Microfabrication Processes of Fraunhofer ISIT also offers the evaluation of printed circuit boards and components used in electronics production. The focus here is on the wetting properties of the PCB pads and component connections, which serve as the basis for solderability.


Press release / 2.2.2023

Best Paper Award at SPIE Photonics West 2023

For their joint work "Coherent LiDAR with 2D quasi-static MEMS mirror scanning", scientists from the Fraunhofer Institute for Silicon Technology and the Fraunhofer Heinrich Hertz Institute received the "Best Paper Award" at the SPIE Photonics West 2023 conference in San Francisco. In addition to first author Sarah Cwalina from HHI, ISIT staff members Norman Laske and Dr. Shanshan Gu-Stoppel were also honored.



Event / 13.9.2023

Green ICT conference & FMD-IDay

In September, Forschungsfabrik Mikroelektronik Deutschland invites you to exchange ideas in the field of resource- and energy-saving ICT at Change Hub Berlin. The "Green ICT Connect" conference, which will take place on September 13, is aimed primarily at the scientific community and is intended to contribute to networking.


job fair / 23.9.2023

Azubiz 2023

Use the opportunity and meet us at Azubiz 2023 in Itzehoe to get an insight into working or training at Fraunhofer ISIT!

The Fraunhofer-Gesellschaft is the leading organization for applied research in Europe and known for being an attractive employer for many reasons.


job fair / 10.10.2023

BerufsInformationsBörse 2023

Seize the opportunity and meet us at the BerufsInformationsBörse on October 10th and 11th in Rendsburg to get an insight into working or training at Fraunhofer ISIT!


trade fair / 23.10.2022

MikroSystemTechnik Kongress 2023

Meet our experts at the MikroSystemTechnick Congress 2023 from 23.10. - 25.10.2023 at the Maritim Congress Center Dresden!

Special topics this year are Technological Sovereignty and Trustworthiness in Microelectronics ("Trusted Electronics"), Sustainability Aspects ("Green ICT") and Next Generation Computing.


Annual report 2022

Here you will find the latest review of the year.


Here you can find all institute brochures and annual reports from previous years.