The Fraunhofer Institute for Silicon Technology operates state-of-the-art production lines for processing silicon with a processing accuracy in the nanometer range. These precise structure generation processes have now been successfully transferred to other materials. The shaping of various types of glass has proven to be particularly significant. After all, with the integration of optical functions into the world of microsystems, the packaging of components and systems at wafer level (WLP) is facing new and exciting challenges. Future new applications, such as augmented and virtual reality in lightweight glasses (AR/VR glasses), require the development of small optical packages, which implies a wide variety of design aspects from the optical, electrical and thermal fields.