Ausgewählte Publikationen
Peer-reviewed paper
- J.-Y. Hwang , L. Wysocki , E. Yarar, G. Wille, F. Röhr, J. Albers and S. Gu-Stoppel
Low Power Compact 3D-Constructed AlScN Piezoelectric MEMS Mirrors for Various Scanning Strategies.
MPFI micromachines, 2023.
- P. Schmitt, B. Gojdka, T. Lisec, M. Kroll and M. Hoffmann
SOI Integrated Micromagnets for Mechanical Magnetic Field Detection.
IEEE Sensors Letters, 2023.
- D. Santos-Carballal, O. Lupan, N. Magariu, N. Ababii, H. Krüger, M. T. Bodduluri, N. H. de Leeuw, S. Hansen, R. Adelung
Al2O3/ZnO composite-based sensors for battery safety applications: An experimental and theoretical investigation.
Nano Energy, 2023.
- S. Schröder, N. Ababii, M. Brînza, N. Magariu, L. Zimoch, M. T. Bodduluri, T. Strunskus, R. Adelung, F. Faupel and O. Lupan
Tuning the Selectivity of Metal Oxide Gas Sensors with Vapor Phase Deposited Ultrathin Polymer Thin Films.
Polymers, 2023.
- M. Frankenberger, C. Mock, N. Kaden, I. Landwehr, J. Veitl, J. Ophey, G. Schälicke, M. Görke, H. Holeczek, A. Kwade, K. Dröder, K.-H. Pettinger
Improving Wetting Behavior and C‐Rate Capability of Lithium‐Ion Batteries by Plasma Activation.
Energy Technology, 2023.
Konferenz-paper
- B. Gojdka, D. Cichon, M. Stahl-Offergeld, D. Schröder, N. Clausen, C. Hedayat, H.-P. Hohe, T. Lisec
Fully Integrated Back-Biased 3d Hall Sensor with Wafer-Level Integrated Permanent Micromagnets.
IEEE MEMS, 2023.
- B. Gojdka, O. Behrmann, M. T. Bodduluri, T. Lisec
PowderMEMS – Generic Integration of Functional Three-Dimensional Microstructures on Wafer Level.
MikroSystemTechnik Congress, 2023.
- F. Ziegler, D. Cichon, M. Stahl-Offergeld, D. Schröder, N. Clausen, C. Hedayat, H.-P. Hohe, T. Lisec, B. Gojdka
Demonstration of wafer-level integrated permanent bias micromagnets for magnetic field sensors.
MikroSystemTechnik Congress, 2023.
- J. Cipo, R.-M. Neubieser, R. Mörtel, T. Lisec, M. Michel, F. Lofink, B. Gojdka
Towards Integrated 3D Microbatteries: Study of LiPON on Porous Electrodes.
MikroSystemTechnik Congress, 2023.
- O. Behrmann, T. Lisec, F. Klingbeil, N. Kyoushi, B. Gojdka
Gas permeable protection caps for wafer level chip scale packaging (WLCSP) of MEMS environmental sensors.
EMPC, 2023.
- O. Behrmann, T. Lisec, S. Billat, A. Dehé, B. Gojdka
Influence of a novel solid thermal isolation material for MEMS in thermopile sensitivity and dynamic response of a MEMS flow sensor.
MikroSystemTechnik Congress, 2023.
- O. Behrmann, T. Lisec, S. Schröder, B. Gojdka
Gas permeable environmental protection caps for Wafer level capping of MEMS gas and pressure sensors.
Transducers, 2023.
- T. Dankwort, M. Ahmed, S. Grünzig, A. Khare, B. Gojdka
High-performance Aluminum Scandium Nitride MEMS energy harvester with wafer-level integrated micromagnets for contactless rotational motion harvesting.
IEEE ICM, 2023.
- L. L. Rautmann, M. Ahmed, B. Rieck, J. Witte, T. Emter, H. Renkewitz, S. Kosleck
Concept and Design of a Prototype Autonomous, Modular Subsea Bottom Station.
Oceans, 2023.
- I. Ge, Y. Jiang, T. Dankwort, S.W. Wright, M. E. Kiziroglou, E. M. Yeatman
MEMS ALN piezoelectric beams with integrated NdFeB magnets for power line and rotational motion energy harvesting.
PowerMEMS, 2023.
- A. Burger
Increasing Battery Safety of Lithium-Ion Batteries By Using Cell-Internal Glass Fiber Sensors for in-Situ Temperature Monitoring.
ECS, 2023.
- G. D. Astudillo, H. Beiranvand, F. Cecati, C. Werlich, A. Würsig, M. Liserre
Integrated Strategy for Optimized Charging and Balancing of Lithium-ion Battery Packs.
IEEE Transactions on Industrial Informatics, 2023.
Fraunhofer-Institut für Siliziumtechnologie