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Mastering the quality and reliability of electronic assemblies is a decisive competitive factor. ISIT supports its customers in this area with services ranging from conceptual design and process management to quality assessment and damage analysis. The components of an assembly are subjected to considerable stress during joining processes, assembly, and field use. Material, design, and process control are the decisive factors in producing high-quality products. Based on decades of experience in analyzing specific damage cases and accelerated aging of pre-series and series samples, ISIT has developed a range of services that enable customers to actively increase the reliability of their products.
The ISIT Module Services working group offers comprehensive process consulting for the manufacture of electronic assemblies.
We are your partner for the further development of electronic assembly processes, the introduction of innovative manufacturing technologies, process optimization, and professional training. We also offer support in the conversion of manufacturing processes, RoHS compliance testing, and the qualification of components and materials.
Discover our wide range of services for prototype development, neutral process validation, and technology transfer to customer-specific manufacturing.
Material screening, process development, and machine demonstrations are typical scenarios for the use of test wafers and test chips. While product wafers are usually expensive and difficult to procure, test wafers can be produced cost-effectively and tailored to specific requirements. In addition to customer-specific solutions, ISIT also offers standardized components for typical applications.
Silicon chips with contacts connected in pairs are suitable for material screening, for example. When these are mounted on the corresponding substrate, it is easy to check whether all contacts are connected and whether there are any short circuits. Even automatic measurement of contact resistances is no problem with the measurement electronics developed by ISIT.
Glass chips, on the other hand, are suitable for verifying the positioning accuracy of machines during customer acceptance or at trade fairs. The use of vernier structures makes it easy to verify positioning accuracy without relying on automatic mark recognition.
The glass and silicon wafers offered by ISIT have a diameter of 200 mm and are manufactured on industrial production lines in our own clean rooms. They are delivered either unsawn or sawn on foil.
Fraunhofer Institute for Silicon Technology
