Wafer cleaning/ Wet Metal Etch
Cleaning of wafers using bench processes Residues of coating and polymers can be removed using acetone, isopropanol and EKC-265 in stainless steel basin with ultrasound. Wafer sizes of 150 mm and 200 mm can be processed.
Spin acid processor for RCA clean of silicon surfaces. Wet etching batch processes for etching of different kinds of metals, e.g. Cu, Mo, Al.
Wet Silicon Etch / Wet Resist Removal / HF based Processes
Wet etching batch processes for etching of different substrates to clean/activate surfaces or create patterns. Hydrofluoric acid processes are used for etching of glass, oxides and nitrides. KOH/TMAH processes are mainly used for etching of silicon. Organic solvent processes are used for removal of photoresist. A spin acid tool is used for etching of GaN and RCA cleaning of silicon surfaces.