Fraunhofer Institute for Silicon Technology
Come and visit our experts at SMTConnect 2023 - and don't miss the opportunity to visit PCIM at the same time.
SMTConnect 2023
Wafer-level Packaging
The packaging of micro components on wafer level uses the precision of semiconductor and microsystem technologies to realize robust and extremely compact setups. The special focus at ISIT is on the hermetic (vacuum) capping of microsensors and actuators as well as micro-optical components using various joining technologies such as glass solders or metals (IR imager wafers with IR windows made of Si). For micro-optical components, packages with optically transparent window areas for the visible range to far infrared can be produced. Wafer-level packaging is also suitable for post-CMOS processing of customer-supplied wafers. Applications for the technology platform include IR sensors and IR imagers, inertial sensors, magnetic field sensors, harvesters and MOEMS devices.
Quality and reliability of electronic assemblies
The control of quality and reliability of electronic assemblies is a decisive competitive factor. ISIT supports its customers in this area with services ranging from conceptual design and process management to failure analysis. The components of an assembly are subjected to considerable stress in soldering processes, assembly and field use. Materials, design and process control are the critical factors in producing high quality products. Based on many years of analyzing actual damage cases and accelerated aged pre-production samples, ISIT has developed a range of services to help customers actively improve the reliability of their products.
- Analytics and environmental testing
- Individual consulting on design and process issues
- Training for production managers and manufacturing personnel
- Targeted R&D projects with third-party funding
- Networking of industrial and scientific competencies in the region
