Sensor + Test 2026

Fraunhofer ISIT has developed a patented process for creating three-dimensional microstructures at wafer-level. This technology enables the integration of micromagnets, thermal insulation, and microfluidic channels into next-generation microsystems. PowderMEMS® offers significant advantages over other methods and allows for precise design of 3D structures, making it ideal for applications in magnetic MEMS, microfluidics, and microelectronics. Visit our stand to learn more about the unique possibilities of PowderMEMS® technology!

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Along with Fraunhofer IIS, ISIT will present the world’s smallest back-biased 3D Hall sensor. By combining the proven HallInOne® technology with PowderMEMS® micromagnets, bias magnets are integrated directly at wafer-level. This eliminates the need for external mounting and allows for application-specific design of the bias field.

Fraunhofer ISIT offers PFAS-free, gas-permeable environmental protection caps that are integrated directly into 8” silicon wafers using the innovative PowderMEMS® process. These caps protect MEMS sensors from harmful environmental influences such as particles and moisture, while simultaneously eliminating the need for separate chip processes.

At Sensor+Test the innovative process developed by Fraunhofer ISIT will be presented, which enables the integration of high-performance PowderMEMS® micromagnets at the wafer level, thereby facilitating the development of highly compact, NV-based quantum sensors.

This technology makes it possible to generate precise magnetic bias fields directly at the chip level. As a result, PowderMEMS® offers decisive advantages for next-generation quantum hardware.