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Controlled quality and reliability is a competitive key factor. Fraunhofer ISIT supports its customers with service offers from the concept phase, through process control to the analysis of field return. During manufacturing and lifetime, all parts of an electronic assembly undergo deteriorative loads such as soldering heat, mounting stress and humidity/temperature cycles in field application. Material selection, design and process control are the decisive factors to deliver products of high quality. Based on many years of analyzing failures from field returns or accelerated aging, ISIT has developed a range of service offers that allow customers to actively increase the reliability of their products.
ISIT's Module Services working group offers comprehensive process consulting for the production of electronic assemblies.
We are your partner for the further development of electronic assembly processes, the introduction of innovative manufacturing technologies, process optimization and professional training. We also offer support with the conversion of manufacturing processes, RoHS compliance testing and the qualification of components and materials.
Discover our wide range of services for the development of prototypes, neutral process validation and technology transfer to customer-specific production.
Test wafers are typically used for material screening, process development, and machine demonstration. In contrast to product wafers, which are expensive and difficult to access, test wafers can be fabricated at lower cost with additional features beneficial for the respective application. Fraunhofer ISIT offers customized wafer designs as well as standard designs for typical applications.
For material screening applications often silicon chips with contacts linked in pairs are used. Placed on a corresponding substrate a daisy chain is formed, which enables easy contact and short measurements. Automated measurement can be performed with a measurement electronic developed by Fraunhofer ISIT. Besides daisy chain resistance measurement and short detection, the electronics is able to determine the contact resistance of the interconnect by Kelvin probe measurements.
The placement accuracy of wafer aligners and die placers can be measured easily with the aid of glass wafers with precise alignment marks and Vernier structures. Automated placement of these chips is often used by equipment manufactures to demonstrate machine capability during fairs and custom handover.
Wafers manufactured by Fraunhofer ISIT are 200mm in diameter. They are produced on industrial production equipment in our in-house clean rooms. Usually, they are delivered as undiced wafers or diced on tape. Fraunhofer ISIT does not sell single chips.
Fraunhofer Institute for Silicon Technology
