The SMTconnect exhibition in Nuremberg (formerly SMT Hybrid Packaging) is the only event in Europe that connects people and technologies from the fields of development, manufacturing, service and application of electronic assemblies and systems.

Fraunhofer ISIT's topics are:

• Process evaluation and optimization in the manufacturing of electronic assemblies: Prototypes, functional models, pre-series, accompanying technology and process transfer, training.
     
  
• Quality and reliability of electronic assemblies: Evaluation of manufacturing quality, failure analysis
     
  
• Wafer level packaging: vacuum packaging with defined damping, manufacturing environment for
  200 mm MEMS wafers, WL-CSP packaging
  
  We are looking forward to meeting you!