SPIE Photonics West 2024

Come and visit our experts at SPIE Photonics West! You are curious what we will present? Find out more about our exhibits below!

Our researchers will present the following topics at SPIE Photonics West in January:

  • MEMS mirrors based on Al(Sc)N
  • Optical packaging on glass-flow technology
  • NeurOSmart - Smart sensor system for human-machine cooperation

Fraunhofer ISIT presents innovative micromirrors driven by the state-of-the-art piezoelectric material AlScN. These mirrors are characterized by impressive drive power, excellent linearity and remarkable long-term stability with extremely low energy consumption. The developed micromirrors not only enable large-area optical scan angles and a broad frequency range, but also versatile applications in spectroscopy, quantum sensing and computing, including the realization of controllable optical tweezers. With existing production equipment at the site, research can be seamlessly transferred to small series production, creating a forward-looking synergy between research and application.

 

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A process based on hot viscous molding of glass has been developed at Fraunhofer ISIT. With the help of this process, it is possible to structure glass wafers with high aspect ratios at wafer level in such a way that the good optical properties are retained.

With the help of this unique technology, new components can be manufactured from glass at wafer level for the first time that meet the qualitative requirements of optics. Thus, microlenses, reflectors and specially shaped optical windows can be realized in large quantities at wafer level without further mechanical processing, which enables cost-effective mass production of micro-optical devices (wafers with gold-plated concave mirrors). In combination with MEMS scanners and active optical devices, this manufacturing process is the key to hermetically encapsulated MEMS devices that meet the high demands of optical functionality (MEMS mirrors with slanted windows).

 

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The NeurOSmart project aims to set a new standard for intelligent hybrid computing architectures in autonomous machines and transportation systems. For this purpose, a high-performance sensor system, AI-supported preprocessing and a novel high-performance, analog-neuromorphic, ultra-low-power in-memory accelerator chip are combined.

The prospect is an increase in energy efficiency of data processing by at least two orders of magnitude. This will enable the development of novel autonomous systems with previously unattainable intelligence and energy efficiency.

 

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