The thinning of wafers is called grinding. As a rule, the grinding process takes place in several steps, each with a finer grain of the grinding wheels. On the one hand, this serves to optimize the process duration and, on the other hand, to reduce the damage to the crystal caused by grinding in the crystal. With an Ultrapolish step, the crystal damage can be almost completely polished away. The resulting surface is largely mirror-like, but by no means reaches the surface quality achieved in chemical-mechanical polishing.
Sawing the wafers is, strictly speaking, a grinding process in which the saw blades are very reminiscent of a cutting wheel. Choosing the right blade is a key factor in getting a high-quality, low-break cut in a reasonable amount of time. But also the design of the wafers has a big impact. Metal structures can help prevent breakouts, while metals in the saw line can cause the saw blade to become dull.