Waferdicing & Grinding

The thinning of wafers is called grinding. As a rule, the grinding process takes place in several steps, each with a finer grain of the grinding wheels. On the one hand, this serves to optimize the process duration and, on the other hand, to reduce the damage to the crystal caused by grinding in the crystal. With an Ultrapolish step, the crystal damage can be almost completely polished away. The resulting surface is largely mirror-like, but by no means reaches the surface quality achieved in chemical-mechanical polishing.
Sawing the wafers is, strictly speaking, a grinding process in which the saw blades are very reminiscent of a cutting wheel. Choosing the right blade is a key factor in getting a high-quality, low-break cut in a reasonable amount of time. But also the design of the wafers has a big impact. Metal structures can help prevent breakouts, while metals in the saw line can cause the saw blade to become dull.


Whole-surface thinning (grinding) of 8" wafers to a target thickness below 100μm, lower target thicknesses using TAIKOTM grinding in cooperation with an external service provider.

  • Grinding and polishing of different materials or composites up to 8" inches

Semi- and fully automatic sawing of semiconductor and glass wafers

  • Round Circle Cut
  • 1.8 KW spindle with 3 "flange and Deep Cutting Nozzle for sawing thick and hard materials
  • saw the IR camera to the back
  • Ultrasonic option for sawing glasses and hard materials
  • Fully automatic single and double spindle saws

Application areas:

  • Semiconductor technology
  • Micro-optics
  • Consumer, industry and automotive


  • Disco fullautomatic Dicer DFD 6340 and 6240
  • Disco automatic dicer DAD 3350
  • Disco Cleaner DCS1440
  • Disco Temperature Unit DTU152 and Ionizer Neccon
  • Various manual and semi-automatic laminators
  • UV imagesetter
  • Disco Grinder DFG 8540
  • Various horizontal furnaces (Centrotherm and Inotherm) up to 900 ° C and vacuum


Silicon, glass