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Fraunhofer Institute for Silicon Technology
Fraunhofer Institute for Silicon Technology
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NeurOSmart
Electronic Energy Systems
Hybrid grids
AC2DC-Converting AC connections to DC connections with higher power transmission
Active front end converter based on MMC
Modular multilevel converter (MMC)
Multi-Energy Converters
GaN-based Power Converters
Tunable resonant-based topologies
Active reliability
Super-HEART
Thermal digital twin
Super-HEART
Battery integration
Multiport partial power processing converter with energy storage integration for EV stationary charging
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Medium Voltage Lab
MMC
Micro-Manufacturing
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Micro-Manufacturing
Wafer-Level Packaging and Processes
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Neon Ultra-Fine Leak Test
Glass Micromachining
Best Poster Award
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Poly Silicon Process Platform
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MEMS Modules
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Chip-Size Packaging
Bumping and Balling
Under-Bump Metallisation
Electrical Through-Connections
Sealing Frames
Test Wafers and Substrates
Silicon Wafers
Glass Wafers
Test Substrates
Quality and Reliability
Electronic Components and Assemblies
Power Electronics, Assemblies, and Modules
Application Center for Process Technology in Assembly Manufacturing
Lighthouse project
TROM2 chip: A chip for mask production
MEMS Applications
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MEMS Applications
Optical Systems
3D Camera
Laser material processing
Piezoelectric driven MEMS scanner
Acoustic systems and microdrives
MEMS In-Ear Speaker
Ultrasound transducer
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PowderMEMS
Sensor technology
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PowderMEMS technology
Technology
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Technology
Power Electronic
Semiconductor Technology for Powerdevices
GaN-Transistor
Laserannealing
Bonder and Debonder
SEM and FIB
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Battery Technology
Lithium Battery Technology
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Power Converter Test Bench
Thermal Imaging
Finite Element Method (FEM) Simulation
Rapid Prototyping Control
Double Pulse Test Bench
Hardware Development
Micro-manufacturing processes
Processes on Wafer-Level
Lithography
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Chemical Vapor Deposition (CVD)
Sputtern & Evaporieren
Electroplating
Electroless Ni / Pd / Au Plating (ENEPIG)
Reactive Ion Etch (RIE)
Chemical-mechanical polishing (CMP)
Assembly production, quality and reliability
MEMS-Applications
Piezo MEMS Technology Platform
Poly Silicon MEMS Technology Platform
Powder MEMS Technology Platform
MEMS cleanroom | 360° tour
Clean room game
Events
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Events
Aspekte moderner Siliziumtechnologie
CMP-Usermeetings
CMP 41
Wet 12
WET 15
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CMP 45
WET-16
ISIT-Lötseminare für die Baugruppenfertigung
Online Events & Webinars
Events
Hands-On Lithium-Ion Battery Seminar
Fraunhofer Annual Conference 2021
FED Conference: PCB Design for Production
Citizens' festival: 75 years of the state of Schleswig-Holstein
Technlogy Seminar - Design for Manufacturing
Lumen + Colours
Technology Days Printed Circuit Board & Assembly
Online-Messe
Microtec nord 2022
Science Day Kiel 2022
Seminar | Smart Power - Battery technologies and the way to sustainable electrification
Microtec nord 2023
Girls' Day 2024
Science Match 2021
Lectures by our experts
Jobs & Careers
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Jobs & Careers
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Interview Bachelor Thesis with David Westerhoff
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Newsroom
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TechBlog of Fraunhofer ISIT
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2022
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Information on the COVID-19 pandemic for customers, cooperation partners and service providers of Fraunhofer ISIT
Advent Calendar
MEMSification Campaign
Energy Harvester
RGB Laser Light Source
LIDAR systems
NeurOSmart
6-axis IMU device (inertial measurement unit, IMU)
Infrared sensors
Miniaturized ozone generator
Ultrasonic sensors
In-Ear-Speaker
Microcoils
TROM2-Chip
FAB-SH
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FAB-SH
Rapid Prototyping
Dry Coating
High-power batteries with extended lifetime
Overview
Equipment
Cell-internal sensor technology
Power400
Battery Systems for Special Applications
Overview
Equipment
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Power400
Smart Battery Cells
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Fraunhofer Institute for Silicon Technology