Chemical-mechanical Polishing (CMP)


Next Meetings:

25th International Symposium on CMP

The International Symposium on Planarization Technologies (CAMP) will be held at High Peaks Resort, Lake Placid, New York from August 06 to 09, 2023. The symposium will be held at Clarkson University - Center for Advanced Materials Processing. There will be ample opportunity to learn about the latest ideas and technologies in chemical mechanical polishing/planarization (CMP) and to network/exchange ideas with colleagues/experts in the field. 

Register by July 21, 2023.

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ICPT 2023 - International Conference on Planarization Technology

The International Conference on Planarization Technology (ICPT) will be held from Oct. 31 - Nov. 2, 2023 in Kanazawa, Japan.

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CMP & WET Users' Meetings

© Fraunhofer ISIT/Eric Shambroom Photography 2020
© Fraunhofer ISIT/Eric Shambroom Photography 2020

The German VDE/VDI-GMM Society for Microelectronics, Micro and Precision Engineering supports developments in microelectronics and microsystem technology and organizes together with ISIT regular CMP users meetings. Target groups are all individuals who employ CMP and use it for production, who manufacture equipment and materials for CMP or who are active in CMP-related R&D.

Since 1998 the CMP Users Meetings are held in regular intervals. The fall meetings are organized in timely connection with Semicon Europa and have developed into an international event. The spring meetings take place at changing locations and are intended as a European forum for CMP information exchange.The conference language of the meeting is English.

The workshops offer opportunities to meet other CMP users and discuss CMP related topics with experts. Short contributions or longer presentations cover new developments in equipment, materials, processes, applications, etc. or inform about CMP-related subjects like measurement, cleaning, media distribution, waste disposal, etc.. Those interested in giving contributions are requested to contact the organizers. Submissions are considered in the order of arrival.

Wet chemical processes like wet etching, wet cleaning and electroplating furtheron play an important role in the manufacturing of microelectronic and MEMS devices. Due to the large overlap with CMP, it has been decided to hold meetings of the Wet Users Group in a tight connection to the CMP Users Meetings. Therefore, invitations to both meetings will be sent out together and future CMP Users Meetings will be introduced by a Wet Users Meeting the day before.

Recent presentations can be downloaded password-protected by the workshop attendees.

CMP Events

International Conference on Planarization/CMP Technology ICPT

ICPT is an annual high-level conference covering all aspects of CMP and has been founded by a co-operation of the CMP Users Groups of China, Europe, Japan, Korea, Taiwan and the United States. The very successful conference takes place generally in fall at changing locations: in Tokyo, Japan (2004), Seoul, South Korea (2005, 2011, 2018), Foster City, CA, USA (2006), Dresden, Germany (2007), Hsinchu, Taiwan (2008, 2013), Fukuoka (2009), Japan, Phoenix, Arizona, USA (2010), Grenoble, France (2012), Kobe, Japan (2014), Chandler, AZ, USA (2015), Beijing, China (2016) and Leuven, Belgium (2017). ICPT 2019 was held on September 16 - September 18, 2019 in Hsinchu, Taiwan.